| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| HLMP-K105 | AVAGO/安华高 | LED | 2010 | 10000 | 2026-01-22 | |||
| HCPL-2211-560E | AVAGO/安华高 | SOP8 | 202048 | 11000 | 2026-01-22 | |||
| HSMS-280C-TR1G | AVAGO/安华高 | SOT-323 | 2017 | 12000 | 2026-01-22 | |||
| HMPP-389T-TR1 | AVAGO/安华高 | MINI | 2005 | 12000 | 2026-01-22 | |||
| HSMP-389F-TR1G | AVAGO/安华高 | SOT323 | 2015 | 120000 | 2026-01-22 | |||
| HSMP-389F-TR1 | AVAGO/安华高 | SOT323 | 2012 | 120000 | 2026-01-22 | |||
| HSMP-389F-BLK | AGILENT/安捷伦 | SOT323 | 2005 | 120000 | 2026-01-22 | |||
| HD64F2357F20V | RENESAS/瑞萨 | QFP | 202138 | 300 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AT45DB041D-SSU-SL954 | ATMEL/爱特梅尔 | SOP8 | 2013 | 3000 | 2026-01-22 | |||
| ETRX357 | SILICON/芯科 | MODULE | 22+ | 600 | 2026-01-22 | |||
| EP3C10U256C6N | ALTERA/阿尔特拉 | BGA | 2011 | 5 | 2026-01-22 | |||
| EPF10K100ARC240-1 | ALTERA/阿尔特拉 | QFP240 | 2015 | 240 | 2026-01-22 | |||
| EP1C6F256C8 | ALTERA/阿尔特拉 | PBGA | 2013 | 270 | 2026-01-22 | |||
| FIN1031MTCX | FAIRCHILD/仙童 | STOCK | 201129 | 2200 | 2026-01-22 | |||
| ESD3V3XU1US E6327 | INFINEON/英飞凌 | TSSLP-2-1 | 2013 | 180000 | 2026-01-22 | |||
| CP2101-GM | SILICON/芯科 | QFN28 | 0419 | 699 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC24FJ256GA704-I/PT | MICROCHIP/微芯 | TQFP-44 | 2016 | 120 | 2026-01-22 | |||
| PIC24F32KA302-I/SS | MICROCHIP/微芯 | SSOP28 | 201624 | 282 | 2026-01-22 | |||
| M29W320EB70ZE6E | MICRON/美光 | BGA | 12 | 1000 | 2026-01-22 | |||
| M95512-DRDW8TP/K | ST/意法 | 17+ | 500 | 2026-01-22 | ||||
| LTC1144CS8 | LINEAR/凌特 | SOIC-8 | 2000 | 1200 | 2026-01-22 | |||
| M30853FHGP#D3 | RENESAS/瑞萨 | LQFP-100 | 2005 | 246 | 2026-01-22 | |||
| IS42S32800B-7BLI | ISSI/芯成 | BGA | 201004 | 800 | 2026-01-22 | |||
| ATXMEGA32A4U-MH | MICROCHIP/微芯 | ORIG | 21+ | 200 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| EN6337QI | INTEL/英特尔 | QFN38 | 2022 | 50000 | 2026-01-22 | |||
| LMZM23600SILR | TI/德州仪器 | USIP-10 | 2018 | 136 | 2026-01-22 | |||
| LM4041CIM7X-1.2/NOPB | TI/德州仪器 | SOT23-5 | 2018 | 3000 | 2026-01-22 | |||
| LT1764EQ#PBF | LINEAR/凌特 | TO263-5 | 2013 | 500 | 2026-01-22 | |||
| LT1762EMS8#PBF | LINEAR/凌特 | MSOP8 | 2015 | 195 | 2026-01-22 | |||
| MAX14920ECB+T | MAXIM/美信 | TQFP64 | 15 | 750 | 2026-01-22 | |||
| ISL78610ANZ | INTERSIL | 22+ | 500 | 2026-01-22 | ||||
| LM1117MPX-3.3/NOPB | TI/德州仪器 | Low-DropoutLinearReg | 200630 | 2000 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| EL4543IUZ | INTERSIL | SSOP24 | 2015 | 250 | 2026-01-22 | |||
| LMZM23600SILT | TI/德州仪器 | USIP-10 | 2018 | 136 | 2026-01-22 | |||
| LMV7235M7/NOPB | TI/德州仪器 | SC70 | 2014 | 3000 | 2026-01-22 | |||
| LMC6462BIMX/NOPB | NS/美国国半 | SOP-8 | 201916 | 650 | 2026-01-22 | |||
| LMC6464AIMX/NOPB | TI/德州仪器 | SOIC | 201907 | 620 | 2026-01-22 | |||
| LMV824MTX | TI/德州仪器 | N/A | 2009 | 400 | 2026-01-22 | |||
| LT2078IS8#PBF | ADI/亚德诺 | SOP-8 | 2018+ | 1007 | 2026-01-22 | |||
| LT1782CS5#TRMPBF | LINEAR/凌特 | SOT23-6 | 2015 | 200 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| ENC624J600-I/PT | MICROCHIP/微芯 | QFP64 | 2015 | 396 | 2026-01-22 | |||
| STEF01FTR | ST/意法 | HTSSOP14 | 2018+ | 2500 | 2026-01-22 | |||
| LTC4316IDD#TRPBF | ADI/亚德诺 | KB0527 | 2500 | 2026-01-22 | ||||
| MAX232EIDR | TI/德州仪器 | SOP16 | 200649 | 2000 | 2026-01-22 | |||
| MAX3243CDBR | TI/德州仪器 | N/A | 2008 | 1030 | 2026-01-22 | |||
| ISL4221EIR | INTERSIL | QFN | 2004 | 5000 | 2026-01-22 | |||
| ISL83070EIBZA-T | INTERSIL | SOP8 | 2013 | 2500 | 2026-01-22 | |||
| ISO7220CDR | TI/德州仪器 | N/A | 2017 | 570 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| EN80C186EB20 | INTEL/英特尔 | PLCC | 2006 | 1895 | 2026-01-22 | |||
| LPC2364FET100 | NXP/恩智浦 | 2021 | 1000 | 2026-01-22 | ||||
| M27C256B-15B1 | ST/意法 | 16+ | 13 | 2026-01-22 | ||||
| M27C512-12F1 | ST/意法 | 16+ | 12 | 2026-01-22 | ||||
| M27C64A-15F1 | ST/意法 | 20+ | 117 | 2026-01-22 | ||||
| M27C801-100F1 | ST/意法 | CDIP-32 | 2017 | 4600 | 2026-01-22 | |||
| M29F040B-90K1 | ST/意法 | PLCC32 | 427+ | 430 | 2026-01-22 | |||
| M27C1001-10B1 | ST/意法 | 21+ | 23 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| EP3C120F484C8N | ALTERA/阿尔特拉 | BGA484 | 2017 | 60 | 2026-01-22 | |||
| LTC6993IS6-2#TRMPBF | ADI/亚德诺 | TSOT-23-6 | 2018 | 100 | 2026-01-22 | |||
| LISA-C200-24S | U-BLOX | LGA | 201616 | 300 | 2026-01-22 | |||
| ISPLSI5256VA-70LQ208I | LATTICE/莱迪斯 | 2001 | 720 | 2026-01-22 | ||||
| ISPLSI5256VA-70LQ208 | LATTICE/莱迪斯 | QFP208 | 2001 | 800 | 2026-01-22 | |||
| S29GL064A90TFIR70 | SPANSION/飞索半导体 | TSOP56 | 613 | 300 | 2026-01-22 | |||
| CD4011BE | TI/德州仪器 | 10000 | 2026-01-22 | |||||
| CLVC1G374QDCKRQ1 | TI/德州仪器 | SC-70 | 2011 | 3000 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| STM32F100C6T6B | ST/意法 | 2013 | 400 | 2026-01-22 | ||||
| LPC1111FHN33/101 | NXP/恩智浦 | HVQFN-33 | 2022 | 10260 | 2026-01-22 | |||
| SPC5748GSK1MMJ6 | NXP/恩智浦 | BGA | 22+ | 4500 | 2026-01-22 | |||
| SPC5743PFK1AMLQ9 | NXP/恩智浦 | LQFP144 | 2021 | 300 | 2026-01-22 | |||
| SPC5748GGK1MMJ6 | NXP/恩智浦 | LBGA256 | 201550 | 200 | 2026-01-22 | |||
| STM32F030CCT6TR | ST/意法 | LQFP48 | 22+ | 50400 | 2026-01-22 | |||
| MPC8321ZQADDC | FREESCALE/飞思卡尔 | BGA | 2011 | 200 | 2026-01-22 | |||
| STM32F439NGH6 | ST/意法 | BGA | 2015 | 10 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DW01 | FORTUN | 16 | 50 | 2026-01-22 | ||||
| DTC343TKT146 | ROHM/罗姆 | SOT-23 | 2012+ | 1496 | 2026-01-22 | |||
| DTC143EUA | ROHM/罗姆 | SOT490 | 2008+ | 1489 | 2026-01-22 | |||
| DTA144EUA T106 | ROHM/罗姆 | SOT323 | 0009+ | 6000 | 2026-01-22 | |||
| DSX321G-27.000MHZ | KDS/大真空 | SMD4 | 09+ | 2055 | 2026-01-22 | |||
| DSX321G-26.000MHZ | KDS/大真空 | SMD | 11+ | 1330 | 2026-01-22 | |||
| DSX151GA3.6864MHZ | KDS/大真空 | 06+ | 2011 | 293 | 2026-01-22 | |||
| DWM1001C | QORVO | MODOULE | 2022 | 950 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| HD6437043AE00FV | RENESAS/瑞萨 | QFP144 | 2010 | 50 | 2026-01-22 | |||
| GWIXP425BDT | INTEL/英特尔 | BGA | 2009 | 240 | 2026-01-22 | |||
| HT48R05A-1 | HOLTEK/合泰 | DIP18 | 03+ | 822 | 2026-01-22 | |||
| HPDL-1414 | HP | DIP-12 | 0136+ | 461 | 2026-01-22 | |||
| HIP6021CB | INTERSIL | SOIC-28 | 0027+ | 54 | 2026-01-22 | |||
| HIN202CB | HARRIS/哈里斯 | SOP-16 | 97+ | 84 | 2026-01-22 | |||
| HFA3983IV96 | INTERSIL | TSSOP28 | 03+ | 1000 | 2026-01-22 | |||
| HEDS-9140 | AVAGO/安华高 | SIP | 1039+ | 136 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| W25Q128FVSIG | WINBOND/华邦 | SOP8 | 2010 | 470 | 2026-01-22 | |||
| XR16C854IV-F | EXAR/艾科嘉 | QFP64 | 18+ | 170 | 2026-01-22 | |||
| XC1702LPC44I | XILINX/赛灵思 | PLCC | 2003 | 2600 | 2026-01-22 | |||
| MC10EP445FAG | ONSEMI/安森美 | QFP32 | 2016 | 100 | 2026-01-22 | |||
| MB86295SPB-GS-JXE1 | FUJITSU/富士通 | NA | 2019 | 278 | 2026-01-22 | |||
| PIC18F25K20-I/ML | MICROCHIP/微芯 | QFN28 | 2008 | 60 | 2026-01-22 | |||
| ATTINY25-20SU | ATMEL/爱特梅尔 | 8SOIC | 22+ | 38746 | 2026-01-22 | |||
| ATSAMD20G17A-AU | ATMEL/爱特梅尔 | NA | 2020 | 145 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XCV1600E-7FG900C | XILINX/赛灵思 | BGA | 200041 | 43 | 2026-01-22 | |||
| XC6SLX150T-3FGG676I | XILINX/赛灵思 | BGA | 2011 | 35 | 2026-01-22 | |||
| XC6SLX150-2FGG484I | XILINX/赛灵思 | 2012 | 50 | 2026-01-22 | ||||
| XC7A35T-2CPG236C | XILINX/赛灵思 | 236-CSBGA | 2022 | 200 | 2026-01-22 | |||
| XC6SLX45-3FGG676C | XILINX/赛灵思 | FBGA-676 | 2016 | 1180 | 2026-01-22 | |||
| XC3S1400AN-4FGG676I | XILINX/赛灵思 | PBGA | 2016 | 70 | 2026-01-22 | |||
| HEF4011BT | NXP/恩智浦 | NA | 18+ | 1000 | 2026-01-22 | |||
| GTLP8T306MTC | FAIRCHILD/仙童 | GTLP8T306MTC | 2017+ | 250 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| NCV47710PDAJR2G | ONSEMI/安森美 | 8-SOIC(0.1543.90mmWi | 2022+ | 7571 | 2026-01-22 | |||
| NCV4274CDT33RKG | ONSEMI/安森美 | TO-252-3DPak(2Leads+ | 2022+ | 450 | 2026-01-22 | |||
| NCV317BD2TG | ONSEMI/安森美 | TO-263 | 2021 | 2000 | 2026-01-22 | |||
| NCP382LD10AAR2G | ONSEMI/安森美 | SOP8 | 201502 | 5000 | 2026-01-22 | |||
| NCP303LSN45T1G | ONSEMI/安森美 | SOT23-5 | 2010+ | 614 | 2026-01-22 | |||
| MAX765ESA+T | MAXIM/美信 | SOIC8 | 2017+ | 500 | 2026-01-22 | |||
| MAX706SESA+T | MAXIM/美信 | 8-SOIC | 2017+ | 500 | 2026-01-22 | |||
| MAX6041AEUR-T | MAXIM/美信 | SOT-23 | 2017+ | 500 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| STR712FR2T6 | ST/意法 | TQFP64 | 2022 | 500 | 2026-01-22 | |||
| STM32L475RCT6 | ST/意法 | LQFP64 | 2023 | 2830 | 2026-01-22 | |||
| STM32L151C8T6A | ST/意法 | 48LQFP | 60 | 2026-01-22 | ||||
| STM32L100RBT6ATR | ST/意法 | ORIGINAL | 22 | 1000 | 2026-01-22 | |||
| STM32H757XIH6 | ST/意法 | TFBGA | 2021 | 714 | 2026-01-22 | |||
| STM32F427AIH6 | ST/意法 | 169UFBGA | 2023 | 10000 | 2026-01-22 | |||
| STM32F401VET6 | ST/意法 | ORIGINAL | 2023 | 4800 | 2026-01-22 | |||
| STM32F303VET6 | ST/意法 | LQFP100 | 2020 | 200 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DSP56002FC66 | MOTOROLA/摩托罗拉 | QFP-132 | 241 | 253 | 2026-01-22 | |||
| MIC2941ABU | MICREL/麦瑞 | TO263-5 | 2017+ | 2000 | 2026-01-22 | |||
| MCP2515-I/P | MICROCHIP/微芯 | NA | 2020 | 25 | 2026-01-22 | |||
| MCF5307AI66B | FREESCALE/飞思卡尔 | QFP208 | 201542 | 8 | 2026-01-22 | |||
| MCF5206ECAB40 | NXP/恩智浦 | QFP160 | 2017 | 120 | 2026-01-22 | |||
| DSP56002FC66 | MOTOROLA/摩托罗拉 | QFP-132 | 0241 | 253 | 2026-01-22 | |||
| MPC8270CZUQLDA | NXP/恩智浦 | BGA | 25 | 2026-01-22 | ||||
| C8051F311 | SILICON/芯科 | QFN28 | 2005 | 500 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LM311D | TI/德州仪器 | NA | 2020 | 50 | 2026-01-22 | |||
| LM26CIM5X-ZHA | NS/美国国半 | 2001 | 3000 | 2026-01-22 | ||||
| ISL6568CRZ-TR5184 | INTERSIL | QFN | 2017 | 500 | 2026-01-22 | |||
| LA4160 | SANYO/三洋 | IC | 2017+ | 250 | 2026-01-22 | |||
| LF1005-S | LEM/莱姆 | MODULE | 2020 | 6 | 2026-01-22 | |||
| R5F100FCA | RENESAS/瑞萨 | QFP | 201146 | 270 | 2026-01-22 | |||
| PQ025ENA1ZPH | SHARP/夏普 | 06+ | 45000 | 2026-01-22 | ||||
| MSP430FG6625IPZR | TI/德州仪器 | N/A | 1000 | 2026-01-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| ATECC608A-SSHDA-T | MICROCHIP/微芯 | 8-UDFN | 2022 | 5000 | 2026-01-22 | |||
| MCCS142235DW | MOTOROLA/摩托罗拉 | SOIC-24 | 2017+ | 500 | 2026-01-22 | |||
| MCP2542FD-E/SN | MICROCHIP/微芯 | SOP-8 | 00+ | 940 | 2026-01-22 | |||
| MCP23S08-E/SS | MICROCHIP/微芯 | NA | 2019 | 1147 | 2026-01-22 | |||
| MCP2021-500E/SN | MICROCHIP/微芯 | SOP8 | 201216 | 394 | 2026-01-22 | |||
| PCA6416APW,118 | NXP/恩智浦 | NA | 18+ | 2500 | 2026-01-22 | |||
| PCA9554ARGTR | TI/德州仪器 | N/A | 2015 | 110 | 2026-01-22 | |||
| PCA9506BS,118 | NXP/恩智浦 | QFN | 21+ | 8180 | 2026-01-22 |